| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition that has little change in heat resistance after a thermal history of a cured product and exhibits low thermal expansion; a cured product thereof; a printed circuit board having little change in heat resistance after a thermal history and excellent low thermal expansion; and a phenolic hydroxy group-containing resin that imparts these performances.SOLUTION: A biphenol-naphthol resin includes a polyfunctional compound (X) represented by structural formula (1) (where, Rand Reach independently represent H, an alkyl group with 1-4 carbon atoms, or an alkoxy group with 1-4 carbon atoms, and n is an integer of 1 or 2 and m is an integer of 0-2), the content of the polyfunctional compound (X) being at least 30% by area ratio in a GPC measurement. |
