LIGHT EMITTING DEVICE PACKAGE

摘要

A light emitting device package according to an embodiment of the present invention includes a first lead frame and a second lead frame electrically separated; a light emitting device electrically connected to the first lead frame and the second lead frame; and a molding portion surrounding the light emitting device, wherein the light emitting device comprises a light extraction layer disposed on at least a portion of an upper surface adjacent to the molding portion. The thickness of the light extraction layer ranges from a number of micrometers to a number of hundreds of micrometers, and the light extraction layer has an inclined surface on a side and the area of the upper surface adjacent to the molding portion is smaller than the area of a lower surface.