| 摘要 |
The present invention relates to a multilayer printed circuit board and a manufacturing method thereof, comprising a base substrate, a via hole passing through the base substrate, first and second seed layers formed on both sides of the via hole, first and second internal circuit patterns and first and second insulation layers formed on the first and second seed layers, and first and second external circuit patterns formed on the first and second insulation layers. According to the present invention, process reliability can be increased because there is no problem such as poor adhesion and gas emission due to thermal impact when thermal compression for adhesion with conductive paste using an existing copper lamination film layer by having a simple process compared to an existing method, filling the via hole with the conductive paste, and hardening the same. |
