| 摘要 |
The method involves machining an element (3) e.g. hole jewel, of a multilevel micromechanical part e.g. bearing (10), in a commercial silicon wafer (1) using a physical or chemical element, where the part is made of commercial single-crystal or polycrystalline silicon. A machining step is repeated for machining another element (4) e.g. solid jewel, with another commercial silicon wafer (2). The elements or the wafers are applied, face to face, using holes (6) and a slot, to form an assembly. The assembly is allowed to undergo oxidation, and the part is separated from the wafers. |
