CUTTING TYPE FLUORESCENCE LAYER MANUFACTURING METHOD AND LED PACKAGE MANUFACTURING METHOD USING THE SAME

摘要

A method of manufacturing a cutting type fluorescent layer according to the present invention includes the following steps of: coating a fluorescent material on a tray for manufacturing a fluorescent layer; hardening the fluorescent layer; cutting and dividing the fluorescent material into a predetermined size; and separating the divided fluorescent material from the tray for manufacturing a fluorescent layer. A method of manufacturing a light emitting diode package according to the present invention includes the following steps of: mounting a light emitting diode chip on a substrate; providing a fluorescent material in at least one receiving groove of the tray for manufacturing a fluorescent layer which includes a body having a predetermined thickness and the at least one receiving groove which is able to receive the fluorescent material on a top surface of the body and which has a depth shallower than the thickness of the body; hardening the fluorescent material; separating the hardened fluorescent material from the tray for manufacturing a fluorescent layer; and forming the fluorescent layer by mounting the separated fluorescent material on the light emitting diode chip.