| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board with built-in electronic component in which an insulation resin formed on the periphery of an electronic component can be prevented from cracking, and to provide a manufacturing method therefor.SOLUTION: A wiring board 1 with built-in electronic component includes a core substrate 2 having a plate thickness of 200 μm or less in which a cavity 3 is formed to penetrate in the plate thickness direction, an electronic component 4 housed in the cavity, a filling resin 5 filling a space between the sidewall surface 31 of the cavity and the electronic component, a first surface side insulation resin layer 50 covering the core substrate and the first principal surface of the electronic component, and a second surface side insulation resin layer 51 covering the core substrate and the second principal surface of the electronic component. The filling resin, the first surface side insulation resin layer and the second surface side insulation resin layer continue with no boundary surface to form an insulation resin portion 80. |
