发明名称 |
LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND PACKING UNIT THEREOF |
摘要 |
A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer. |
申请公布号 |
US2014151103(A1) |
申请公布日期 |
2014.06.05 |
申请号 |
US201313918512 |
申请日期 |
2013.06.14 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
AHN Young Ghyu;PARK Sang Soo;PARK Min Cheol;JEONG Se Hwa |
分类号 |
H01G4/005;H05K1/02 |
主分类号 |
H01G4/005 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
Suwon KR |