RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND PRINTED CIRCUIT BOARD

摘要

The present invention addresses the problem of providing: a resin composition having various properties that are desirable in a printed circuit board material such as high flame retardancy, excellent formability, and excellent chemical resistance in a desmearing process and that is capable of yielding a cured product having a low coefficient of thermal expansion; a prepreg containing the resin composition; a laminated plate provided with the prepreg; a metal foil-clad laminated plate provided with the prepreg; and a printed circuit board provided with the prepreg. The resin composition contains an acrylic-silicone copolymer (A); a non-halogen epoxy resin (B); a cyanate ester compound (C) and/or a phenol resin (D); and an inorganic filler (E).