发明名称 Impedance Controlled LGA Interposer Assembly
摘要 An interposer plate assembly having an insulating plate and metal contacts in the plate with contact points above and below the plate and a central portion in the plate. Two cantilever arms extend from the central portion to each contact point. The central portion may form an impedance shield for reducing impedance between adjacent signal contacts.
申请公布号 US2014162472(A1) 申请公布日期 2014.06.12
申请号 US201313899095 申请日期 2013.05.21
申请人 Amphenol InterCon Systems, Inc. 发明人 Walden John D.;Hileman James S.
分类号 H01R12/00 主分类号 H01R12/00
代理机构 代理人
主权项 1. An interposer plate assembly for forming electrical connections between contacts on opposed substrates, the assembly comprising an insulating plate having a top surface, a bottom surface and a thickness between the top surface and the bottom surface; and a plurality of one-piece metal contacts, each contact comprising a central portion in the plate, a first contact point spaced from one side of the plate to engage a pad, two first cantilever arms extending from the central portion to the contact point, and an opening through the contact between the arms.
地址 Harrisburg PA US