| 发明名称 |
SEMICONDUCTOR LEAD FRAME PACKAGE AND LED PACKAGE |
| 摘要 |
The present invention relates to a semiconductor lead frame package and LED package. The semiconductor lead frame package includes a die pad, a lead, a die and an insulator body. The lead is electrically isolated from the die pad. The die is disposed on the die pad and electrically connected to the lead. The insulator body partially encapsulates the die pad and the lead, and has a top surface and a bottom surface, wherein a part of the lead is folded onto the top surface of the insulator body. |
| 申请公布号 |
US2014159098(A1) |
申请公布日期 |
2014.06.12 |
| 申请号 |
US201213710933 |
申请日期 |
2012.12.11 |
| 申请人 |
INC. ADVANCED SEMICONDUCTOR ENGINEERING, |
发明人 |
Chen Ying-Zhong |
| 分类号 |
H01L33/36;H01L21/56;H01L23/495 |
主分类号 |
H01L33/36 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A structure comprising:
a die pad; a lead; a die disposed on a top surface of the die pad and electrically connected to a main portion of the lead disposed above the die pad; and an insulator body partially encapsulating the die pad and the lead, an electrode portion of the lead being folded onto a top surface of the insulator body, the electrode portion being parallel to the main portion, wherein a bottom surface of the die pad is exposed from a bottom surface of the insulator body.
|
| 地址 |
US |
