STACKED TYPE POWER DEVICE MODULE

摘要

The disclosure relates to a stacked type power device module. May use the vertical conductive layer for coupling the stacked devices, the electrical transmission path may be shortened. Hence, current crowding or contact damages by employing the conductive vias or wire bonding may be alleviated.

主权项

1. A stacked type power device module, at least comprising:
a substrate, having a first surface and a second surface opposite to the first surface; at least one first device, located on the first surface of the substrate and electrically connected to the substrate; at least one second device, located on the at least one first device and electrically connected to the substrate; at least one filler layer, covering the first surface of the substrate and encapsulating the at least one first device and the at least one second device, wherein the at least one filler layer comprises a plurality of first plugs and at least one second plug; and a circuit pattern, located above the at least one second device and located on the at least one filler layer, wherein the circuit pattern connects to the at least one second device via the plurality of first plugs, and the circuit pattern connects to the at least one first device via the at least one second plug, wherein a height of the at least one second plug is greater than a height of each of the plurality of first plugs.