发明名称 POLYIMIDE, COPPER-CLAD LAMINATE, FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE FLEXIBLE PRINTED CIRCUIT BOARD
摘要 A polyimide is formed by dehydrating a polyamic acid. The polyamic acid is formed by polymerizing a diamine and a fluorine dianhydride. The diamine is 2,2′-bis[4-(4-aminophenoxy) phenyl] propane, and the fluorine dianhydride is 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride. When a color of the polyimide is defined by Lab color space, b component is set from about −10 to about +10. The disclosure further relates to a copper-clad laminate, a flexible printed circuit, and a method for manufacturing the flexible printed circuit.
申请公布号 US2014158410(A1) 申请公布日期 2014.06.12
申请号 US201314093669 申请日期 2013.12.02
申请人 Zhen Ding Technology Co., Ltd. 发明人 HO MING-JAAN
分类号 H05K1/09;H05K3/02 主分类号 H05K1/09
代理机构 代理人
主权项 1. A polyimide being formed by dehydrating a polyamic acid, wherein the polyamic acid is formed by polymerizing a diamine and a fluorine dianhydride, the diamine is 2,2′-bis[4-(4-aminophenoxy) phenyl] propane, and the fluorine dianhydride is 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, when a color of the polyimide is defined by Lab color space, b component is set from −10 to +10.
地址 Tayuan TW