| 摘要 |
PROBLEM TO BE SOLVED: To provide a glass interposer which includes wiring having an adhesion force to glass and a through electrode with no void, achieves high reliability, and is excellent in electric characteristics, and to provide a manufacturing method of the glass interposer.SOLUTION: A manufacturing method of a wiring board with a through electrode includes: a step where a wiring formation part 3 of a first layer and a land formation part 4 of the first layer are formed in glass 1; a step where a metal layer 6 is formed only on a surface of the glass 1; a step where blind holes 7 are formed only in a portion in the glass 1 which ranges from the land formation part 4 on a rear surface to the land formation part 4 on a front surface; a step where the blind holes 7 are buried by electrolytic plating using the metal layer 6 to form through electrodes 8; a step where a metal layer 14 is formed on the rear surface of the glass 1; and a step where the metal layers 6 and 14 on the front and rear surfaces of the glass 1 are polished until the glass 1 is exposed. |
