| 摘要 |
The invention relates to a polyamide composition with an increased resistance against blistering that is for example the result of a reflow soldering process. The composition comprises: A) 99-50 wt % of at least one polyamide A derived from: A1) at least one di-amine monomer having 4 carbon atoms and wherein the amount of C4-diamine is at least 2 mol % relative to the total amount of di-amine and, A2) at least one di-acid monomer, wherein at least one of the monomers has at least one aromatic structural unit, and wherein the polyamide A, has a molecular weight, expressed as Mn, of at least 9000 g/mol, and B) 1-50 wt % of at least one reinforcing agent and C) 0-20 wt % of inorganic fillers and/or additives, D) 0-49 wt % of one or more polymers other than A) wherein the sum of A, B, C and D amounts to 100 wt %. The invention also relates to the use of the polyamide composition and to a shaped article made out of the polyamide composition. |
