| 发明名称 | Electronic device and manufacturing method thereof | ||
| 摘要 | An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant. | ||
| 申请公布号 | US8922312(B2) | 申请公布日期 | 2014.12.30 |
| 申请号 | US201313853083 | 申请日期 | 2013.03.29 |
| 申请人 | Cyntec Co., Ltd. | 发明人 | Liao Wen-Hsiung;Hsieh Roger;Ikuta Hideo;Chen Yueh-Lang |
| 分类号 | H01F27/02 | 主分类号 | H01F27/02 |
| 代理机构 | Litron Patent & Trademark Office | 代理人 | Teng Min-Lee;Litron Patent & Trademark Office |
| 主权项 | 1. An electronic device, comprising: a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder, wherein the conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant; wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the insulating encapsulant. | ||
| 地址 | Hsinchu TW | ||