| 摘要 |
PROBLEM TO BE SOLVED: To provide curable resin compositions which impart flame retardance to cured products of the resin compositions, have low roughness and sufficient peel strength, and allow preparation of cured products that can achieve low linear thermal expansion coefficients and low dielectric loss tangents.SOLUTION: A curable resin composition contains (A) one or more compounds represented by the general formula (1) in the figure, (B) an epoxy resin, (C) a curative for the epoxy resin, and (D) an inorganic filler. |
