| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a liquid processing apparatus which efficiently processes a pattern formation surface of a wafer while preventing the diffusion of a chemical atmosphere that may occur during chemical processing.SOLUTION: A liquid processing apparatus 10 comprises: a process fluid nozzle 65 provided above a wafer W and having a discharge port discharging a chemical to the wafer W; a process fluid supply mechanism 70 supplying the chemical to the process fluid nozzle 65; and a cover mechanism 60 covering the wafer W from above when the chemical is discharged to the wafer W by the process fluid nozzle 65. The cover mechanism 60 is vertically driven by a lifting drive mechanism 78 between a falling position where the cover mechanism 60 covers the wafer W from above and a lifting position that is positioned higher than the falling position. Further, the liquid processing apparatus 10 includes an air hood 31 shielding the wafer W from the cover mechanism 60 in the vertical direction when the cover mechanism 60 is positioned at the lifting position and generating down flow of a clean gas.</p> |
