| 发明名称 |
POLISHING AGENT, POLISHING AGENT SET, AND SUBSTRATE POLISHING METHOD |
| 摘要 |
The polishing agent of the invention comprises water, an abrasive grain containing a hydroxide of a tetravalent metal element, polyalkylene glycol, and at least one cationic polymer selected from the group consisting of allylamine polymers, diallylamine polymers, vinylamine polymers and ethyleneimine polymers. |
| 申请公布号 |
US2015017806(A1) |
申请公布日期 |
2015.01.15 |
| 申请号 |
US201314379954 |
申请日期 |
2013.02.14 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
Akutsu Toshiaki;Minami Hisataka;Iwano Tomohiro;Fujisaki Koji |
| 分类号 |
C09G1/02;H01L21/306 |
主分类号 |
C09G1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing agent comprising:
water, an abrasive grain containing a hydroxide of a tetravalent metal element, polyalkylene glycol, and at least one cationic polymer selected from the group consisting of allylamine polymers, diallylamine polymers, vinylamine polymers and ethyleneimine polymers. |
| 地址 |
Tokyo JP |
