发明名称 |
APPARATUS AND METHOD FOR MANUFACTURING LED PACKAGE |
摘要 |
An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit. |
申请公布号 |
US2015017748(A1) |
申请公布日期 |
2015.01.15 |
申请号 |
US201414502463 |
申请日期 |
2014.09.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JI Won Soo;KIM Choo Ho;OH Sung Hoon;KIM Min Hwan;SHIN Beom Seok |
分类号 |
H01L21/66;H01L33/48 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for manufacturing a light emitting diode (LED) package, the method comprising:
preparing an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; heating the LED package array; testing an operational state of each of the LED packages in the LED package array using a probe pin by applying a voltage or a current to the LED package array heated by the heating, to determine whether each of the LED packages in the LED package array is a functional product or a defective product, based on the testing, and to generate test results based on the determination; and cutting an LED package determined to be a defective product according to the test results so as to be removed from the lead frame. |
地址 |
Suwon-si KR |