发明名称 |
SOFT MAGNETIC COMPOSITE, METHOD FOR PREPARING THE SAME, AND ELECTRONIC COMPONENTS INCLUDING THE SAME AS CORE MATERIAL |
摘要 |
Disclosed herein are a soft magnetic composite including an insulating layer formed along an inter-particle boundary of a soft magnetic core metal powder, a method for preparing the same, and electronic components including the same as a core material.;The soft magnetic composite according to the present invention may include the insulating layer formed along the inter-particle boundary of the soft magnetic core metal particles, such that damage to a coating film caused by a molding of the existing soft magnetic powder having the insulation coating film formed therein may be prevented, whereby an eddy current loss may be minimized. |
申请公布号 |
US2015015359(A1) |
申请公布日期 |
2015.01.15 |
申请号 |
US201414330817 |
申请日期 |
2014.07.14 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Hak Kwan;KWON Sang Kyun;LEE Sung Jae;AN Sung Yong |
分类号 |
H01F27/255;B22F1/00;B22F3/14 |
主分类号 |
H01F27/255 |
代理机构 |
|
代理人 |
|
主权项 |
1. A soft magnetic composite comprising an insulating layer formed along an inter-particle boundary of a soft magnetic core metal powder. |
地址 |
Suwon-si KR |