发明名称 SOFT MAGNETIC COMPOSITE, METHOD FOR PREPARING THE SAME, AND ELECTRONIC COMPONENTS INCLUDING THE SAME AS CORE MATERIAL
摘要 Disclosed herein are a soft magnetic composite including an insulating layer formed along an inter-particle boundary of a soft magnetic core metal powder, a method for preparing the same, and electronic components including the same as a core material.;The soft magnetic composite according to the present invention may include the insulating layer formed along the inter-particle boundary of the soft magnetic core metal particles, such that damage to a coating film caused by a molding of the existing soft magnetic powder having the insulation coating film formed therein may be prevented, whereby an eddy current loss may be minimized.
申请公布号 US2015015359(A1) 申请公布日期 2015.01.15
申请号 US201414330817 申请日期 2014.07.14
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM Hak Kwan;KWON Sang Kyun;LEE Sung Jae;AN Sung Yong
分类号 H01F27/255;B22F1/00;B22F3/14 主分类号 H01F27/255
代理机构 代理人
主权项 1. A soft magnetic composite comprising an insulating layer formed along an inter-particle boundary of a soft magnetic core metal powder.
地址 Suwon-si KR