ASSEMBLY FOR A MEMS ENVIRONMENTAL SENSOR DEVICE HAVING IMPROVED RESISTANCE, AND CORRESPONDING MANUFACTURING PROCESS

摘要

Described herein is an assembly for a MEMS sensor device, which envisages: a first body made of semiconductor material, integrating a micromechanical detection structure at a first main face thereof; a cap element, set stacked on the first main face of the first body, above the micromechanical detection structure; and an adhesion structure set between the first body and the cap element, defining a gap in a position corresponding to the micromechanical detection structure. At least one first opening is defined through the adhesion structure in fluidic communication with the gap.

主权项

1. An assembly for a MEMS sensor device, the assembly comprising:
a first body including semiconductor material, the first body having a first main face and integrating a micromechanical detection structure at the first main face; a cap element coupled to the first main face of said first body and facing said micromechanical detection structure; and an adhesion structure between said first body and said cap element defining a gap between said micromechanical detection structure and said cap element, the adhesion structure including an opening that places the gap in fluidic communication with an environment external to said gap.