发明名称 |
METHODS TO CONTROL WAFER WARPAGE UPON COMPRESSION MOLDING THEREOF AND ARTICLES USEFUL THEREFOR |
摘要 |
Provided herein are multilayer structures having a reduced propensity to warp upon curing of certain components thereof. In one aspect, there are provided multilayer assemblies comprising a plurality of the above-described multilayer structures. In another aspect, there are provided methods for reducing wafer warpage upon cure of molding compositions applied thereto. In yet another aspect, there are provided methods for preparing wafers having substantially no warpage upon cure thereof. |
申请公布号 |
WO2015013024(A1) |
申请公布日期 |
2015.01.29 |
申请号 |
WO2014US45710 |
申请日期 |
2014.07.08 |
申请人 |
HENKEL IP & HOLDING GMBH;TAKANO, TADASHI;HOANG, GINA |
发明人 |
TAKANO, TADASHI;HOANG, GINA |
分类号 |
H01L23/28 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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