JOINING DEVICE, JOINING SYSTEM, JOINING METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To properly adjust horizontal positions of a first holding part for holding a first substrate and a second holding part for holding a second substrate, and properly perform joint processing of substrates.SOLUTION: A joining device 41 comprises: an upper chuck 140 for holding an upper wafer Won its lower surface; a lower chuck 141 provided below the upper chuck 140 and holding a lower wafer Won its upper surface; a first lower chuck moving part 170 and a second lower chuck moving part 179 for moving the lower chuck 141 to the horizontal direction and the vertical direction; an upper imaging part 151 provided on the upper chuck 140 and imaging a surface of the lower wafer Wheld on the lower chuck 141; and a lower imaging part 171 provided on the lower chuck 141 and imaging a surface of the upper wafer Wheld on the upper chuck 140. The upper imaging part 151 has an infrared camera.