| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device that has high reliability and is easy to be downsized.SOLUTION: A semiconductor device includes a semiconductor stack, an electrode, a metal wiring terminal part, and a junction metal layer. The semiconductor stack has, in its first surface, an operating layer and conductor layers provided outside the operating layer. The electrode has one end connected to a predetermined region of the operating layer. The metal wiring terminal part has one end provided outside the operating layer on the first surface. The junction metal layer is provided on a second surface of the semiconductor stack that is located on the opposite side of the first surface. The conductor layers are connected to the other end of the electrode and one end of the metal wiring terminal part.</p> |
