MULTILAYER PRINTED WIRING BOARD

摘要

A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer.

主权项

1. A method for manufacturing a multilayer printed wiring board, comprising:
providing a core base material having a penetrating portion and placed on a support material; mounting a low-thermal-expansion substrate having a through-hole conductor on the support material such that the low-thermal-expansion substrate is placed in the penetrating portion of the core base material; forming at least one insulation layer on the low-thermal-expansion substrate and the core base material such that a portion of an insulating material of the insulation layer is filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material and that the low-thermal-expansion substrate is fixed to the core base material; forming a conductive layer on the insulation layer; forming inside the insulation layer a via conductor electrically connected to the conductive layer; and removing the support material after the low-thermal-expansion substrate is fixed to the core base material.