发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide good electric characteristics to a semiconductor device using an oxide semiconductor; or provide a semiconductor device having high reliability.SOLUTION: A semiconductor device manufacturing method comprises: a process of forming an oxide semiconductor layer on an insulating surface; a process of forming a source electrode and a drain electrode on the oxide semiconductor layer; a process of depositing an insulation film and a conductive film in this order on the oxide semiconductor layer, the source electrode and the drain electrode; a process of forming a gate electrode and a gate insulation layer by etching a part of the conductive film and insulation film, and forming a first coating layer including constituent element of the source electrode and the drain electrode in contact with a lateral face of the gate insulation layer by etching a part of upper parts of the source electrode and drain electrode; a process of forming a second coating layer by oxidizing the first coating layer; and a process of depositing an oxide-containing protective insulation layer on the second coating layer.</p> |
申请公布号 |
JP2015019057(A) |
申请公布日期 |
2015.01.29 |
申请号 |
JP20140120122 |
申请日期 |
2014.06.11 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
SASAGAWA SHINYA;KURATA MOTOMU;HANAOKA KAZUYA;HONDO SUGURU |
分类号 |
H01L21/336;H01L21/28;H01L21/8242;H01L21/8247;H01L27/108;H01L27/115;H01L29/417;H01L29/423;H01L29/49;H01L29/786;H01L29/788;H01L29/792 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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