发明名称 WIRE SAW AND CUTTING PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce a load imposed on a wire when vibrating the wire of a wire saw to cut a workpiece.SOLUTION: A wire saw 1 comprises a wire row formed by winding a wire 4 between plural groove rollers 9a, 9b, a workpiece holding table 44 which presses a workpiece W to the wire row, and a vibrating block 20 to which the plural groove rollers 9a, 9b are supported pivotally and integrally, and cuts the workpiece W by pressing the workpiece W to the wire row. The vibrating block 20 is configured so that the plural groove rollers 9a, 9b are integrally vibrated and circularly-moved; the workpiece holding table 44 is configured so that the workpiece W can be elevated so as to be pressed to the wire row and the workpiece W can be moved horizontally along the wire 4 of the wire row; and associated with the vibration and circular motion of the vibrating block 20, the work holding table 44 is horizontally moved in the direction of reducing the load on the wire 4 at a cutting part.
申请公布号 JP2015016538(A) 申请公布日期 2015.01.29
申请号 JP20130146754 申请日期 2013.07.12
申请人 TAKATORI CORP 发明人 MIYAGI KUNIHIKO;SHIMAI NORIMASA
分类号 B24B27/06;B28D5/04;H01L21/304 主分类号 B24B27/06
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