发明名称 UNDERLAYER FILM MATERIAL AND PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resist underlayer film material that can be stripped with alkaline water without damaging an ion-implanted Si substrate or SiOsubstrate due to novolak resin having a recurring unit derived from fluorescein being hydrolyzed in alkaline water to generate a carboxyl group and turning soluble with an alkaline aqueous solution.SOLUTION: The present invention provides a photoresist underlayer film material to be used for lithography which comprises a novolak resin having a recurring unit derived from a substituted or unsubstituted fluorescein.
申请公布号 JP2015018223(A) 申请公布日期 2015.01.29
申请号 JP20140107792 申请日期 2014.05.26
申请人 SHIN ETSU CHEM CO LTD 发明人 HATAKEYAMA JUN;KOORI DAISUKE;OGIWARA TSUTOMU
分类号 G03F7/11;C08G8/20;G03F7/26;G03F7/42;H01L21/027 主分类号 G03F7/11
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