发明名称 B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES
摘要 This invention is an adhesive composition that has sufficient mechanical and adhesive strength to withstand manufacturing operations at temperatures between 125° to 210°C without first being cured. In brief, the cure after the die attach operation is skipped, and the adhesive can perform without out-gassing and creating voids through the wire bonding operation, at temperatures typically 125° to 210°C, and molding operation, at temperatures typically 170° to 80°C. The adhesive composition comprises (i) a low glass transition (Tg) acrylate monomer, (ii) a difunctional acrylate/epoxy compound, (iii) a phenoxy resin, and (iv) a solid epoxy resin.
申请公布号 WO2015010231(A1) 申请公布日期 2015.01.29
申请号 WO2013CN79762 申请日期 2013.07.22
申请人 ABLESTIK (SHANGHAI) LIMITED;HENKEL IP & HOLDING GMBH 发明人 YU, YUANYUAN;ZHUO, QIZHUO;WANG, CHUANGUANG
分类号 C09J163/00 主分类号 C09J163/00
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