摘要 |
This invention is an adhesive composition that has sufficient mechanical and adhesive strength to withstand manufacturing operations at temperatures between 125° to 210°C without first being cured. In brief, the cure after the die attach operation is skipped, and the adhesive can perform without out-gassing and creating voids through the wire bonding operation, at temperatures typically 125° to 210°C, and molding operation, at temperatures typically 170° to 80°C. The adhesive composition comprises (i) a low glass transition (Tg) acrylate monomer, (ii) a difunctional acrylate/epoxy compound, (iii) a phenoxy resin, and (iv) a solid epoxy resin. |