发明名称 |
WIRING BOARD |
摘要 |
To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring substrate is characterized in that a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member. |
申请公布号 |
US2015027750(A1) |
申请公布日期 |
2015.01.29 |
申请号 |
US201314376744 |
申请日期 |
2013.04.10 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
Nishida Tomohiro;Mori Seiji;Wakazono Makoto |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A wiring substrate comprising a layered structure including one or more insulation layers and one or more conductor layers, the wiring substrate being characterized in that
a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; the filling member has a thickness smaller than that of the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member. |
地址 |
Nagoya-shi, Aichi JP |