发明名称 CONDUCTIVE SILVER PASTE FOR A METAL-WRAP-THROUGH SILICON SOLAR CELL
摘要 A conductive silver via paste comprising particulate conductive silver, a vanadium-phosphorus-antimony-zinc-based-oxide, a tellurium-boron-phosphorus-based-oxide or a tellurium-molybdenum-cerium-based-oxide and an organic vehicle is particularly useful in providing the metallization of the holes in the silicon wafers of MWT solar cells. The result is a metallic electrically conductive via between the collector lines on the front side and the emitter electrode on the back-side of the solar cell. The paste can also be used to form the collector lines on the front-side of the solar cell and the emitter electrode on the back-side of the solar cell. Also disclosed are metal-wrap-through silicon solar cells comprising the fired conductive silver paste.
申请公布号 WO2014123840(A3) 申请公布日期 2015.01.29
申请号 WO2014US14553 申请日期 2014.02.04
申请人 E. I. DU PONT DE NEMOURS AND COMPANY 发明人 HANG, KENNETH, WARREN;WANG, YUELI
分类号 H01B1/02;H01B1/22;H01L31/00 主分类号 H01B1/02
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