发明名称 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser processing apparatus and a laser processing method that, while reducing damage to a base plate surface due to a processing laser (e.g., annealing laser), are capable of processing (e.g., annealing) from the surface of the base plate to a deeper area, and is able to reduce the time for the processing.SOLUTION: A laser annealing processing apparatus 100 according to one embodiment of the present invention comprises: a laser beam generating device 101 that oscillates a femtosecond laser for temporarily increasing the light absorption rate of an area of an object 112 to be processed, and a nanosecond laser absorbed by the area where the light absorption rate is temporarily increased; and an XYZ stage 111 provided downstream of the laser beam generating device 101, and having a setting surface on which the object 112 to be processed can be set. The laser beam generating device 101 emits a nanosecond laser from a pulse of a femtosecond laser by delaying within a predetermined time required for the light absorption rate of the one area where the light absorption rate has temporarily increased to return to the former light absorption rate.</p>
申请公布号 JP2015018980(A) 申请公布日期 2015.01.29
申请号 JP20130145987 申请日期 2013.07.12
申请人 AISIN SEIKI CO LTD;TOYOTA MOTOR CORP 发明人 HIEJIMA HIROYOSHI;OTA MICHIHARU;KOMURA YUTA
分类号 H01L21/265;H01L21/268 主分类号 H01L21/265
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