PLATING METHOD, PLATING SYSTEM AND STORAGE MEDIUM

摘要

A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layer 23a serving as a barrier film on a substrate 2; baking the first plating layer 23a; forming a second plating layer 23b serving as a barrier film; and baking the second plating layer 23b. A plating layer stacked body 23 serving as a barrier film is formed of the first plating layer 23a and the second plating layer 23b.

主权项

1. A plating method of performing a plating process on a substrate, the plating method comprising:
a substrate preparing process of preparing the substrate; a plating layer forming process of forming a plating layer having a preset function by performing the plating process on the substrate with a plating liquid; and a plating layer baking process of baking the plating layer by heating the substrate, wherein by repeating the plating layer forming process and the plating layer baking process at least twice, a plating layer stacked body having a first plating layer obtained through a first plating layer forming process and a first plating layer baking process and a second plating layer obtained through a second plating layer forming process and a second plating layer baking process is formed.