| 发明名称 |
PRINTED CIRCUIT BOARD AND IMAGE FORMING APPARATUS |
| 摘要 |
A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate has a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion. |
| 申请公布号 |
US2015027766(A1) |
申请公布日期 |
2015.01.29 |
| 申请号 |
US201414326193 |
申请日期 |
2014.07.08 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Ogawara Satoshi |
| 分类号 |
H05K1/16;G03G15/00 |
主分类号 |
H05K1/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board, comprising:
a substrate on which a component is mounted by solder; and a contact plate including a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate includes a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion. |
| 地址 |
Tokyo JP |
