| 摘要 |
<p>A multilayer printed circuit board, comprising at least two wiring layers (112, 114, 116, 118) and an isolation layer sandwiched between the at least two wiring layers (112, 114, 116, 118); the at least two wiring layers (112, 114, 116, 118) comprise a copper foil area (140); and at least one of the at least two wiring layers (112, 114, 116, 118) is provided with a dummy groove (150) for adjusting thermal stress, the dummy groove (150) being disposed on the copper foil area (140). The multilayer printed circuit board breaks the integrity of the large piece of copper foil by providing an etched line groove, that is, by etching away part of the copper foil, thus reducing the stress generated by a large area of foil, and balancing the stresses of each wiring layer without space limitation or noise.</p> |
