| 摘要 |
<p>Provided is an electroless copper plating solution forming a highly adhesive conductive film and having a high deposition speed regardless of the resin surface roughness. The electroless copper plating solution according to the present invention contains guanosine. Preferably, the electroless copper plating solution according to the present invention further contains copper ion, a reducing agent, a copper ion complexing agent, and a pH adjusting agent.</p> |
