发明名称 広スペクトル帯域幅を有するレーザ・パルスを用いた材料の加工方法、および該方法を実行するための装置
摘要 <p>A method and device for processing materials with laser pulses having a large spectral bandwidth and a device for carrying out said method. The aim of the invention is to create an easy, flexible method enabling universally applicable processing which can, however, be adapted to specific processing and methodological requirements. According to the invention, one or several spectral parameters of the laser pulses, i.e. the spectral amplitude and/or spectral phase and/or spectral polarization thereof, is/are specifically modified, preferably according to a measuring process variable, in order to process material or during the occurrence of said processing. The invention is used in order to process material with laser pulses having a large spectral bandwidth, particularly femto-second pulses and pico-second pulses.</p>
申请公布号 JP5659103(B2) 申请公布日期 2015.01.28
申请号 JP20110171866 申请日期 2011.08.05
申请人 发明人
分类号 B23K26/00;A61F9/008;B23K26/06;B81B7/02;B81C99/00 主分类号 B23K26/00
代理机构 代理人
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