| 摘要 |
<p>THERE IS A DEMAND FOR A TIN ELECTROLYTIC PLATING SOLUTION, AND A TIN ELECTROPLATED ELECTRONIC PART, WHICH CAN SATISFY ALL OF THE FOLLOWING REQUIREMENTS IN THE TIN ELECTROLYTIC PLATING OF ELECTRONIC PARTS: (1) IMPROVE SMOOTHNESS OF A PLATING FILM TO SUPPRESS OXIDATION; (2) IMPROVE PRODUCT YIELD BY REDUCING "STICKING" OF CHIP PARTS; AND (3) INCREASE CURRENT EFFICIENCY TO IMPROVE PRODUCTIVITY. THE INVENTION PROVIDES A TIN ELECTROLYTIC PLATING SOLUTION INCLUDING A SUITABLY SELECTED NONIONIC SURFACTANT HAVING A BRANCHED ALKYL GROUP. THE NONIONIC SURFACTANT IS CONTAINED EITHER ALONE, OR WITH A SUITABLY SELECTED CATIONIC SURFACTANT AND/OR A SUITABLY SELECTED ALKYL IMIDAZOLE. THE INVENTION ALSO PROVIDES A CIRCUIT BOARD COMPRISING THE TIN ELECTROLYTIC PLATING SOLUTION, AND A TIN ELECTROPLATED ELECTRONIC PART SOLDER-MOUNTED THEREON.</p> |
