| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce percent defective and improve reliability and ensure wettability of a solder material.SOLUTION: A semiconductor device comprises: a die pad 1 on which a recess 2 is provided on a principal surface; a plated film 3 provided in the recess 2; a solder material 4 coated on the plated film 3; a semiconductor element 5 bonded with the die pad 1 by the solder material 4 in the recess 2; and a resin 7 which encapsulates the semiconductor element 5 bonded with the die pad 1. The plated film 3 has wettability with the solder material 4 higher than that of the die pad 1. |
