发明名称 Wiring board
摘要 This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.
申请公布号 US8963672(B2) 申请公布日期 2015.02.24
申请号 US201214129148 申请日期 2012.06.21
申请人 Kabushiki Kaisha Toyota Jidoshokki 发明人 Asano Hiroaki;Koike Yasuhiro;Ozaki Kiminori;Shimadu Hitoshi;Furuta Tetsuya;Miyake Masao;Hayakawa Takahiro;Asai Tomoaki;Yamauchi Ryou
分类号 H01F27/29;H01F27/28;H05K1/11;H05K3/20;H05K1/16;H05K1/02 主分类号 H01F27/29
代理机构 Greenblum & Bernstein, P.L.C. 代理人 Greenblum & Bernstein, P.L.C.
主权项 1. A wiring board comprising: an insulative core substrate; a patterned first conductive pattern adhered to the insulative core substrate; a patterned second conductive pattern adhered to the insulative core substrate, wherein the second conductive pattern and the first conductive pattern are adhered to the same surface of the insulative core substrate, the second conductive pattern includes a first surface that faces toward the insulative core substrate and a second surface that is opposite to the first surface, the second conductive pattern includes a recess that opens in the first surface and a through hole that extends from the first surface to the second surface, and an opening of the recess that opens in the first surface and an opening of the through hole that opens in the first surface are in communication with each other; and a conductive material that electrically connects the first conductive pattern and the second conductive pattern to each other, wherein the first conductive pattern is thinner than the second conductive pattern and has a current line with a smaller cross-sectional area than that of the second conductive pattern, and the first conductive pattern extends on the insulative core substrate so as to be arranged in the opening of the recess, and the conductive material, which is filled into the through hole from an opening that opens in the second surface, electrically connects the first conductive pattern and the second conductive pattern.
地址 Aichi-Ken JP