Integrated circuits and systems and methods for producing the same

摘要

Three dimensional integrated circuits including semiconductive organic materials are described. In some embodiments, the three dimensional integrated circuits include one or more electronic components that include a semiconductive region formed of one or more semiconductive organic materials. The electronic components of the three dimensional integrated circuits may also include insulating regions formed from organic insulating materials, and conductive regions form from conductive materials. The three dimensional integrated circuits may be formed by an additive manufacturing process such as three dimensional printing. Apparatus and methods for producing and testing three dimensional integrated circuits are also described.

主权项

1. A three dimensional printing apparatus, comprising:
a controller; a print head; and a materials store; wherein: said controller is configured to process a digital model of an integrated circuit into a plurality of layers with a host processor; said integrated circuit includes at least one electronic component comprising at least one semiconductive region; and said print head is configured to produce an operable physical copy of said integrated circuit by iteratively depositing on a support each of said plurality of layers using one or more materials contained in said materials store.