发明名称 Flexible hermetic semiconductor solar cell package with non-hermetic option
摘要 A device containing a solar cell chip that may include a hermetically sealed chamber containing optical matching fluid and a threaded pedestal mounting to allow for replacement of solar cell units and that are easily mountable to a master heat sink.
申请公布号 US8962989(B2) 申请公布日期 2015.02.24
申请号 US201113224232 申请日期 2011.09.01
申请人 Solar Junction Corporation 发明人 Lamarche Paul F.
分类号 H01L31/00;H01L31/042;H02N6/00;H01L31/02;H01L31/052 主分类号 H01L31/00
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Allen Kenneth;Lambert William R.;Kilpatrick Townsend & Stockton LLP
主权项 1. A low profile photovoltaic package, comprising a circular base, comprising: an upper layer comprising aluminum nitride, a middle layer comprising molybdenum, and a lower layer comprising oxygen-free, high-conductivity copper, wherein the upper layer, the middle layer, and the lower layer are characterized by a high and comparable coefficient of thermal expansion;the upper layer is electrically nonconductive;the middle layer and the lower layer are electrically conductive; andelectrically conductive traces on a top surface of the upper layer; an annular ceramic ring hermetically sealed to the top surface with an epoxy or with an adhesive, wherein the annular ceramic ring is configured to form a compartment; a photovoltaic device mounted to the circular base within the compartment and electrically interconnected to the electrically conductive traces; bypass diodes mounted to the circular base, wherein the bypass diodes are interconnected to the photovoltaic device and to the electrically conductive traces; an externally threaded pedestal fixedly attached to a bottom surface of the lower layer; a cover, wherein the cover comprises: a quartz window comprising an outer diameter; andan iron-nickel-cobalt alloy disk characterized by a low thermal expansion coefficient and comprising an inner diameter.
地址 San Jose CA US