发明名称 COVERED WIRE SEPARATE PROCESSING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a covered wire separate processing apparatus capable of performing separate processing of covered wire such as a thin line having an external covering diameter of about 3.2 mm to a thick single line having e.g., an external covering material diameter of about 20 mm, stranded wire covered with PE, and cable.SOLUTION: A covered wire separate processing apparatus 100 includes: a pair of rotary blades 10 and 10 which oppose each other for making a cut in a covered layer 90 of a covered wire 150; and pair of covered wire transporting means (projecting discs) 2 and 2 which oppose each other and which transport the covered wire 150 in a predetermined direction while holding the covered wire 150 with pointed projections 3. The covered wire transporting means 2 and 2 are provided on both side surfaces of the rotary blades 10 and 10. The plurality of pointed projections 3, which become pointed from bottom to top are provided on peripheral portions of the discs at predetermined intervals.</p>
申请公布号 JP2015047071(A) 申请公布日期 2015.03.12
申请号 JP20140237104 申请日期 2014.11.05
申请人 ASK:KK 发明人 HASHIZUME MICHINORI;KAJINO JIRO;SHIMIZU KAORU
分类号 H02G1/12;B26D1/24;B26D3/00 主分类号 H02G1/12
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