| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering device having a small in-plane dispersion of a film formed on a substrate.SOLUTION: A sputtering device comprises: an electrode 310 having a holding part 311 for holding a target 50 for applying a potential to the target 50 through the holding part 311; a first magnet 331 and a second magnet 332 arranged to interpose a space SP between a substrate arrangement surface SS to be arranged with a substrate and the holding part 311, and spaced from each other in a direction along the substrate arrangement surface SS; a shield 340 arranged at a position between the first magnet 331 and the second magnet 332 and between the substrate arrangement surface SS and the holding part 311; and a rotary drive part 430 for rotating the target 50, the first magnet 331 and the second magnet 332 integrally. |
