SEMICONDUCTOR SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE INCLUDING CURED PRODUCT THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a resin composition excellent in reliability and capable of providing a cured product having less thermal decomposition (weight loss) even when placed in a high temperature of 200°C or more, for example, 200-250°C for a long period and excellent adhesion to a CuLF or an Ag plating film in a high temperature and high humidity environment.SOLUTION: The resin composition comprises: (A) a cyanate ester compound having two or more cyanate groups in one molecule; (B) a phenolic compound represented by a general formula (2) and having two or more phenolic hydroxyl groups in one molecule and a specific structure; (C) an inorganic filler; and (D) an epoxy resin having a specific structure represented by general formulae (3) or (4). A molar ratio of a phenolic hydroxyl group in (B) the phenolic compound to a cyanate group in (A) the cyanate ester compound is 0.2-0.4, and a molar ratio of an epoxy group in (D) the epoxy resin to the cyanate group in (A) the cyanate ester compound is 0.04-0.25.