发明名称 FILM DEPOSITION APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a film deposition apparatus which is simply configured and can reduce unnecessary consumption of organic materials.SOLUTION: A film deposition apparatus includes: a vapor deposition head 16c which ejects deposition gas including vapor deposition material gas; a treatment vessel 11 which defines a treatment chamber 12 which accommodates a substrate S facing the vapor deposition head and the vapor deposition head 16C; a vapor generating part 31 which generates vapor of the vapor deposition material X; transportation pipes L12 and L13 which connect the vapor generating part to the vapor deposition head 16C and can be heated; a position detection sensor which obtains a relative position between the substrate S and the vapor deposition head 16c; and a first MFC41 which controls rate of carrier gas which is supplied to the vapor generating part depending on the relative position.</p>
申请公布号 JP2015078391(A) 申请公布日期 2015.04.23
申请号 JP20120012188 申请日期 2012.01.24
申请人 TOKYO ELECTRON LTD 发明人 IKUTA HIROYUKI;KUBOTA SHINJI;SEKI NOBUAKI
分类号 C23C14/24 主分类号 C23C14/24
代理机构 代理人
主权项
地址