发明名称 HEAT CONDUCTIVE COMPONENT, HEAT CONDUCTIVE STRUCTURE, ELECTRONIC COMPONENT MODULE, AND ELECTRONIC APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat conductive component capable of conducting heat from a heating element even if a contacted surface of the heating element has an irregular shape.SOLUTION: Heat from a first substrate 11 or a second substrate 12, which serves as a heating element, is conducted to a heat conductive component 1. The heat conductive component 1 has a contact surface 2 which makes surface contact with the first substrate 11 or the second substrate 12 serving as the heating element. The contact surface 2 is formed into an irregular shape matching with an irregular shape of an electronic component placed on a contacted surface of the first substrate 11 or the second substrate 12 serving as the heating element, which faces the contact surface 2.</p>
申请公布号 JP2015080059(A) 申请公布日期 2015.04.23
申请号 JP20130215373 申请日期 2013.10.16
申请人 RICOH CO LTD 发明人 YAMASHITA NAOYUKI
分类号 H04N5/225 主分类号 H04N5/225
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