发明名称 WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a highly reliable wiring board and a wiring board manufacturing method.SOLUTION: A wiring board comprises: a substrate; a first rib part formed on one surface of the substrate; a second rib part which is formed on the first rib part and along a longer direction of the first rib part, and which has a width narrower than that of the first rib part; a third rib part which is formed on the one surface of the substrate and along the first rib part; a fourth rib part which is formed on the third rib part and along a longer direction of the third rib part, and which has a width narrower than that of the third rib part; and distribution lines each of which is composed of metal nano ink and formed between the first rib part and the second rib part, and the third rib part and the fourth rib part, and along the first rib part, the second rib part, the third rib part and the fourth rib part.</p>
申请公布号 JP2015079889(A) 申请公布日期 2015.04.23
申请号 JP20130216792 申请日期 2013.10.17
申请人 FUJITSU LTD 发明人 AKIE MASANORI
分类号 H05K3/28;H05K3/10 主分类号 H05K3/28
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