发明名称 |
印刷用液状組成物及びそれを用いて得られる導体配線及びその形成方法、熱伝導路、接合材 |
摘要 |
PROBLEM TO BE SOLVED: To provide a metallic copper film in which a printing pattern of a liquid composition for printing making a particle comprising a copper oxide as a principal ingredient is processed using formic acid or formaldehyde and there is little void to be dense.SOLUTION: The liquid composition for printing includes: a copper oxide (I) particle and/or a copper oxide (II) particle; a compound having a carbonyl group; and a solvent. The liquid composition for printing includes at least 0.0005 mass% and less than 0.1 mass% of the compound having a carbonyl group based on a total amount of the copper oxide (I) particle and/or the copper oxide (II) particle. The liquid composition for printing is heat-treated under the reducing gas atmosphere after the printing and drying to form the conductor wiring. |
申请公布号 |
JP5713181(B2) |
申请公布日期 |
2015.05.07 |
申请号 |
JP20110015153 |
申请日期 |
2011.01.27 |
申请人 |
日立化成株式会社 |
发明人 |
中子 偉夫;山本 和徳;神代 恭;横澤 舜哉;稲田 麻希;黒田 杏子 |
分类号 |
C09D11/02;C09D5/24;C09D11/00;C09D11/033;C09D11/36;C09D11/52;H01B1/22;H01B13/00;H05K3/12 |
主分类号 |
C09D11/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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