发明名称 INDUCTIVELY-COUPLED PLASMA CVD APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an inductively-coupled plasma CVD apparatus capable of forming a thin film at excellent productivity.SOLUTION: An inductively-coupled plasma CVD apparatus comprises: a vacuum chamber having a dielectric window which allows high frequency to pass through the window; a sheet conveyance part which feeds sheet from a feeding roller, and takes up the sheet by a take-up roller after a surface of the sheet is positioned in a film deposition zone inside the vacuum chamber; a raw material gas supply part which supplies raw material gas into the film deposition zone; a high frequency applying part which applies high frequency to the raw material gas supplied to the film deposition zone via the dielectric window to generate inductively-coupled plasma of the raw material gas, and forms a thin film on a surface of the sheet positioned in the film deposition zone; and a contamination preventing member which is positioned in the vicinity of a surface of the dielectric window, which faces the film deposition zone, and suppresses contact between the inductively-coupled plasma generated in the film deposition zone and the dielectric window.
申请公布号 JP2015086417(A) 申请公布日期 2015.05.07
申请号 JP20130224411 申请日期 2013.10.29
申请人 SERUBAKKU:KK 发明人 WADA KAZUO;SHIROSHITA YASUHIRO
分类号 C23C16/44;H01L21/205;H05H1/46 主分类号 C23C16/44
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